Last Saturday, eight outstanding teams from the IC Taiwan Grand Challenge presented their groundbreaking innovations across diverse fields, including semiconductors, artificial intelligence, satellite communications, smart manufacturing, smart medtech, and green architecture. Key highlights included sub-20nm chip structures, AI accelerators, energy-saving metal 3D printing, and air-purifying smart building materials—each demonstrating exceptional performance, low power consumption, and a strong commitment to sustainability. 

Replay ▶️ https://www.youtube.com/live/fTidOkpTm3g?si=t8MXCyjHenHRpN7Y

📍 The next call for proposals will launch on November 1st! Apply for the competition and learn more about the winning teams from our official website: https://ictaiwanchallenge.org/