【News Release】ICTGC Batch 1 Winners Received Their Awards in TIE 2024
According to Deloitte, the global semiconductor industry is forecasted to reach USD 588 billion in 2024, a 13% increase compared to the value in 2023. Emerging tech applications, especially generative AI (GenAI), are the main driving force behind this growth as they require dedicated GPUs, CPUs, HBM3 in advanced 2.5D packaging, and related techniques.
Over 75% of the global semiconductor fab capacity is currently focused in Asia, especially Taiwan. Taiwan has become increasingly vital for the world's ICT supply chain. To leverage Taiwan's semiconductor expertise by integrating chips with critical innovations, Taiwanese government ministries launched a collaborative effort named the Taiwan Chip-based Industrial Innovation Program (Taiwan CbI), and one of the main programs: IC Taiwan Grand Challenge, which was started by the National Science and Technology Council (NSTC) to bolster Taiwan's IC startup ecosystem and attract global tech talent and investment. The IC Taiwan Grand Challenge is open to startups, university teams, and individual entries that focus on IC design innovations and chip-based innovative applications.
The winners of the first batch of the competition were announced on September 10, 2024, including teams from Taiwan, the US, and the UK, and will receive a USD 30,000 cash prize to help the winners kick off their efforts in collaborating with Taiwan's local industries, as well as other additional rewards, including review and mentoring by industry experts, IC Startup Accelerating Platform, and business development resources.
Registration for the second batch of the IC Taiwan Grand Challenge is now open, the teams that are planning to collaborate with Taiwan's semiconductor industry are sincerely welcome to register now!
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