Galaverse is a US-AU team that boasts decades of experience in the semiconductor industry and specializes on modularized products. One of the first batch winners of the IC Taiwan Grand Challenge in the Smart Mobility category, Galaverse boasts decades of experience in the semiconductor industry and specializes on modularized products. Their Advanced AI Sensing Chip for New Sensor Networks utilizes advanced AI algorithms to process complex communication signals, enabling seamless integration of sensing and communications (ISAC).

Networks as Sensors Relies on Existing Infrastructure and Modern Chips

According to a 2021 report by Siemens, existing communication infrastructures provide both full area coverage as well as a good interconnection between nodes, which facilitates a multi-static sensory mesh. This advantage can be combined with the right chips to enable sensing by network; essentially using communication signals for spatial sensing. This was already possible several years ago with the introduction of WiFi or WLAN sensing, but with the latest generation of AI-powered mobile communications; users might be able to extract more information at faster speeds and better clarity. For example, a 2022 report by Nokia Bell Labs proposed that 6G networks can be utilized as sensors to generate highly-realized digital versions of the physical world.

Introducing IC Taiwan Grand Challenge

To boost Taiwan's position as a global semiconductor powerhouse, the National Science and Technology Council (NSTC) organizes the IC Taiwan Grand Challenge. Focusing on teams actively leveraging innovative IC design to develop advanced application solutions or enhanced technologies, the ICTGC puts special attention to teams in the fields of Smart Data & AI, Smart Mobility, Smart Manufacturing, Smart Medtech, and Sustainability.

Networks as Sensors Provide the Dual Function of Communication and Sensing

One of the winners of the IC Taiwan Grand Challenge in the Smart Mobility Category, Galaverse boasts decades of experience in the semiconductor industry and specializes on modularized products. Their main products incorporate high-frequency RF front-end from sub-6GHz to mmWave, AI-powered beamforming, as well as easy-to-integrate modularized architecture, and foundry collaboration design. Founded by a group of semiconductor veterans from US-AU and Europe whose talents cover critical businesses for engineering design, manufacture, and fabrication.

As communication systems evolve and grow more complex, AI-powered joint sensing and communication networks will become a standard feature in future 6G and WLAN systems. By incorporating generative AI, such as Generative Adversarial Networks (GANs) and Variational Autoencoders (VAEs), they are able to significantly enhance the performance of advanced wireless sensing and ISAC. Galaverse achieves this by generating synthetic training data, bolstering signal processing capabilities, and compensating for noise and missing data, all of which are critical for future intelligent heterogeneous 6G networks (3GPP).

Their AI-powered sensing silicon chip technology has vast potential applications, poised to elevate cellular networks in open spaces and support a wide range of use cases, including: autonomous vehicles, vehicle to everything (V2X) communications, drone Synthetic Aperture Radar (SAR) imaging, robotics, health monitoring, people ID identification, 3D localization mapping and much more.

Galaverse's core team consists of members with strong network connections, including several Taiwanese members. In the future, Galaverse is expected to leverage Taiwan's IC technical talents and hire a local team in Taiwan for chipset design integration.

As one of the winners of the IC Taiwan Grand Challenge, Galaverse will also join the Taiwan Innotech Expo (TIE) event from October 17 – 19, 2024 in TWTC Hall 1. Interested parties are welcome to visit Galaverse in TIE for their exhibition and pitch & demo event.