Taiwan StartUp Interview - Astron

 2025-11-14 By: 台北市電腦公會

Amid the accelerating wave of digital transformation, data centers and high-performance computing (HPC) have become twin engines driving technological progress.

Focusing on high-speed interconnect and high-power busbar solutions, Astron is proactively advancing its technologies and products toward full compliance with the Open Compute Project (OCP) standards. This commitment enables enterprises to lower costs, improve energy efficiency, and adopt new technologies more rapidly—keeping pace with industry trends.

Astron notes that the rapid expansion of AI, HPC, and cloud services has fueled rising demand for high-power, high-efficiency power delivery systems in data centers. Several of Astron’s solutions have already been adopted by Tier-1 OEMs and major global cloud providers, underscoring the company’s proven reliability, production capability, and supply chain readiness.

To sustain its innovation momentum, Astron continues to invest heavily in R&D, introducing its comprehensive BusFlow® Busbar Solution, designed for IT Gear and Power Shelf applications. Fully compliant with OCP ORv3 standards, BusFlow® has also achieved OCP-Inspired™ Certification. The solution delivers higher power efficiency, reduced operating costs, and greater system stability—ideal for mission-critical environments requiring high availability.

As an active member of the OCP community, Astron stays closely aligned with OCP’s evolving architectures. Through deep technical engagement and practical design implementation, the company helps reduce deployment complexity, accelerate integration, and enhance scalability and reliability for customers worldwide.

Astron also emphasizes key OCP domains such as Rack & Power, Cooling Environments, and Servers, ensuring seamless compatibility and flexible integration across open architectures. These efforts anticipate customer needs for modular systems, higher energy efficiency, and faster deployment.

Looking ahead, Astron will continue to focus on its two core technology pillars—high-speed interconnects and high-power busbars—while accelerating development of modular products built on the OCP framework. The company is also keeping pace with emerging 48 V architectures and advanced liquid-cooling and immersion solutions.

In parallel, Astron is developing its solutions in accordance with OCP’s new ORv3 High-Power Rack (HPR) standard, which centers on a ±400 V DC architecture with a planned expansion to 800 V DC. This evolution will support the next generation of ultra-high-density, energy-intensive data centers.

Reference: Astron website