Exhibitor

 TopoLogic Inc.

JapanInnoVEX 2026  S0724

Startup

Semiconductor Application

Pavilion: IC TAIWAN GRAND CHALLENGE Pavilion

Online Matchmaking Funding Stage: Series A Founding Year: 2021
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TL-RAM's photo

TL-RAM

A high-capacity cache memory technology, which allows placement of 5-10x more cache memory compared to conventional SRAM memory cells. The technology incorporates MRAM design with a new material technology called topological antiferromagnets. The technology is fully compatible with conventional embedded MRAM manufacturing process, while allowing for high capacity and high-speed using the unique properties of the material.

TL-SENSING's photo

TL-SENSING

A rapid heat sensing technology, allowing early detection of thermal runaway of Li-Ion batteries, measurement of thermal dissipation properties of processors and other electronics, and visualization of internal temperature. The sensor utilizes a unique thermoelectric phenomenon called Anomalous Nernst Effect, which allows for a thin film-based heat flux sensor. Heat flux sensors are capable of slight changes in heat dissipation compared to temperature sensors as it detects the actual energy dissipated from a component, disregarding the thermal capacity of the component. Thin-film-based sensor structure allows for mass production of the sensor at low cost allowing for cost structures that can be used in embedded applications. One of the applications in development is a early detection sensor for therma anomalies in EV batteries.

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Company Description

TopoLogic develops high-capacity cache memory replacement technology, allowing 5-10x cache memory capacity increase compared to conventional technologies. This allows for a significant increase in parallel computing capabilities for the processor, as the bottleneck of a lack of quickly accessible memory is an ever increasing issue with high performance processors.
We also develop a heat sensing technology which allows millisecond order detection, 100x faster than conventional thermal sensors. This is useful in things such as early detection of thermal runaway in Li-Ion batteries, measurement of thermal output from processors, and calculation of thermal efficiency in mechanical components.