NanoWiring-Cube

The NanoWiring Cube is an automatic production machine, based on electroplating, with which you can process any type of NanoWiring structure in between 30nm and 100µm on materials like Wafers, Leadframes, PCB and FPC or ceramics and glass in a structure of 3µm and 300mm Pad size. The process follows a flexible receipe scipt. Via ethernet/network it is possible to link the machine into the production network and the dynamic receipe databank. NanoWired offers a 24/7 service and online help functionalize for the operator.

NanoWired has developed a direct copper bonding technology at room temperature.
We substitute solder silver sintering and bond wire technology and create a full copper joint at room temperature.
Therefore we grow with our unique machine and process directly NanoWiring Structures on a contact and this in between 3µm and 300mm.

NanoWiring technology is by reduction of process steps – total cost of ownership less than as Solder, Silver Sintering or Bond wire technology.

We are ready for mass production and to scale the machine development for Semiconductor industry, professionalized the organization and further develop our technology.