Redefine Data Center Efficiency with Infiniflux
Infiniflux is a UK-based startup aiming to alleviate thermal constraints for future chip generations with their ChipCool technology. As one of the winners of the IC Taiwan Grand Challenge Batch 4 in the AI Core Technologies and Chips category, Infiniflux’s proprietary and patent-pending cooling technology addresses the thermal wall in HPC chips to allow them to run at lower temperatures at higher compute densities.
Thermal Limitations are Walls for Compute Density
Semiconductors for AI and HPC applications today operate under a significant thermal constraint as computation demand rises. To address this trend, manufacturers have started to lean more into liquid cooling, not only to properly cool the vital components, but also to improve hardware utilization, efficiency, and lifespan. However, this solution faces clear limitations as AI/HPC compute density has effectively hit a thermal management wall where package-level thermal resistance is no longer manageable with today’s cooling methods. Infiniflux's ChipCool technology features a package-integrated, two-phase silicon cold plate that bypasses the thermal bottlenecks and scales to 3D architectures, leading to 15% more compute capacity, much lower energy and maintenance costs, and at least 2x longer chip lifespan compared with the best 1-phase cooling systems.
Introducing IC Taiwan Grand Challenge
To strengthen Taiwan's position as a global semiconductor powerhouse, the National Science and Technology Council (NSTC) organizes the IC Taiwan Grand Challenge. Started in 2024, the competition originally focused purely on innovative IC designs and advanced application solutions. Today, ICTGC also honors teams in the fields of AI Core Technologies and Chips, Smart Mobility, Smart Manufacturing, Smart Medtech, and Sustainability, which can support and contribute to the semiconductor industry and Taiwan’s industry in general. Infiniflux was selected as one of the winners of ICTGC Batch 4 with their ChipCool technology in the AI Core Technologies and Chips category.
Breaking Through the Thermal Management Wall with ChipCool
Founded in 2023, Infiniflux offers a package-level, two-phase cooling solution that is both scalable and adoptable. Aiming to remove the dominant heat spreader and TIM bottlenecks, Infiniflux delivers up to 4x lower junction-to-coolant thermal resistance than current 1-phase DLC systems—unlocking 5x cooling efficiency with zero die modification, enabling higher sustained performance, longer component lifetime, and improved utilisation of deployed compute assets.
As AI compute demand doubles every 6 to 9 months, chiplets, HBM stacks and BSPD intensify heat density while thermal limits cap performance, yield, and reliability. Infiniflux's ChipCool is based on a proprietary combination of 2-phase liquid cooling and direct-to-die cooling. It is compatible with existing die designs and 2.5D chip architectures, delivering industry-leading performance while keeping GPUs 15-20ºC cooler, even at >1000W per chip. ChipCool's thermal management capabilities enable higher sustained frequency and longer AI workloads, doubling GPU lifespan and provides 20–25°C lower junction temperature compared to conventional cold plates. By reducing the thermal constraints, Infiniflux's cooling technology also offers chip designers new design freedom, which will translate into even higher performing AI/HPC chips.